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WHO WE ARE
The IP & Technology Enabling Quality and Reliability organization is committed to advancing circuit reliability. We design specialized test chips to characterize various reliability mechanisms and conduct silicon stress experiments on these chips. Additionally, we gather silicon stress data from complete Analog, IO, and Memory IP test chips. This data is crucial for validating our reliability models through a process known as Sil2Sim, ensuring that our simulations accurately reflect real-world conditions. Our efforts also focus on enabling optimization across power, performance, and reliability, ensuring that Intel products achieve the highest standards of efficiency and dependability. Moreover, we leverage AI and machine learning techniques to conduct reliability risk assessments at the product level. By analyzing silicon stress data from test chips, these advanced technologies help us predict potential reliability risks and optimize product designs and specs accordingly.
WHO YOU ARE
We are seeking a highly motivated and skilled candidate to join our team for a project focused on reliability characterization and modeling to assess risk on product performance. The ideal candidate will possess a strong background in device physics, digital and mixed signal circuit design, SPICE simulations, and Python coding. This role offers a unique opportunity to contribute to the development of cutting-edge technologies and methodologies that will shape the future of reliability in electronic products. The candidate will be instrumental in driving innovation and ensuring the robustness of our products in diverse performance & thermal environments.
The candidate will play a pivotal role in advancing our understanding and management of transistor and thermal reliability in electronic devices and circuits. The scope of the job encompasses several key areas of research and development, aimed at ensuring product performance and longevity under varying voltage, frequency, and thermal conditions.
Responsibilities include but not limited to:
Custom circuit design, pre-Si validation, layout and tape-in of designs targeted to support development of Intel's next generation products.
Understand mechanisms that limit reliability of Intel's latest products, define creative approaches to characterize these mechanisms through circuit design on test chips, architect the test chips, and develop design definitions, design schematics and work with layout engineers on implementation.
Develop test programs, develop and execute design of experiments, reliability modeling and work with product design and quality and reliability teams for reliability risk assessments.
Behavior skills we are looking for:
Excellent problem-solving skills and ability to work independently and collaboratively in a team environment.
Strong communication skills for presenting research findings and collaborating with diverse teams.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Applied Physics, Physics, or a related field with 6+ years relevant experience or
Master's degree in Electrical Engineering, Computer Engineering, Applied Physics, Physics, or a related field with 4+ years relevant experience or
PhD in Electrical Engineering, Computer Engineering, Applied Physics, Physics, or a related field with 2+ years relevant experience.
Relevant experience should be with the following:
Device physics and digital/mixed signal circuit design.
SPICE simulations and Python coding for data analysis and modeling.
Preferred Experience:
Experience with FPGA programming using VHDL or Verilog.
Proven track record of research and publications in reliability, particularly thermal reliability, is highly desirable.
Prior experience in reliability testing and characterization.
Strong background in reliability statistics.
Familiarity with industry-standard tools and methodologies for reliability assessment.
Knowledge of test board design and implementation.
Demonstrated ability to innovate and develop new concepts in device and circuit reliability.
Reliability modeling using machine learning/AI are an added advantage.
Benefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003
Annual Salary Range for jobs which could be performed in the US:
$161,230.00-$227,620.00Salary range dependent on a number of factors including location and experience.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.Company:
IntelEmployee Type:
Full timeLocation:
United StatesSalary:
$ 161230 - $ 227620